Description
This specification and its supplementary detail specifications cover boron filaments in the form of tape impregnated with epoxy resin, the resin to be supplied in a “B” stage condition. Primarily for fabricating high-strength and high-modulus composite parts, using either hand-layup or automated-tape-layup.
Product Details
- Published:
- 04/01/2001
- File Size:
- 1 file , 97 KB
