Description
SAE AMS3731/10C covers an unfilled, room-temperature-polymerizingepoxy resin formulation with a polyamide hardener, supplied as atwo-component system.
Product Details
- Published:
- 11/29/2017
- Number of Pages:
- 4
- File Size:
- 1 file , 930 KB
Genuine ANSI, AS, BS, AWS Standards
All Codes In PDF Versions
$39.00
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible (Stabilized: Nov 2017)
standard by SAE International, 11/29/2017
SAE AMS3731/10C covers an unfilled, room-temperature-polymerizingepoxy resin formulation with a polyamide hardener, supplied as atwo-component system.