Description
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
Product Details
- Published:
- 05/01/2014
- Number of Pages:
- 22
- File Size:
- 1 file , 310 KB
- Redline File Size:
- 2files, 4 MB
