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ASTM F542-98

$24.60

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
standard by ASTM International, 10/10/1998

Category:

Description

1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.

Product Details

Published:
10/10/1998
Number of Pages:
3
File Size:
1 file , 36 KB