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ASTM F459-13

$23.00

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
standard by ASTM International, 01/01/2013

Category:

Description

1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).

Note 1Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.

Product Details

Published:
01/01/2013
Number of Pages:
5
File Size:
1 file , 84 KB
Redline File Size:
2files, 130 KB