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ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, −55 to +230 °C (−65 to +450 °F) (Noncurrent: Jan 1993) standard by SAE International, 01/01/1993
This specification has been declared “NONCURRENT” by the Aerospace Materials Division, SAE, as of July, 1992.
