Description
This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages.
Product Details
- Published:
- 12/01/1984
- Number of Pages:
- 12
- File Size:
- 1 file , 110 KB
Genuine ANSI, AS, BS, AWS Standards
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CHIP CARRIER PINOUTS STANDARDIZED FOR CMOS 4000, HC AND HCT SERIES OF LOGIC CIRCUITS
standard by JEDEC Solid State Technology Association, 12/01/1984
This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages.