Description
This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
Product Details
- Published:
- 03/01/2011
- Number of Pages:
- 18
- File Size:
- 1 file , 770 KB
